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MT9M034 Scheda tecnica(PDF) 3 Page - ON Semiconductor

Il numero della parte MT9M034
Spiegazioni elettronici  1/3-Inch CMOS Digital Image Sensor
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Produttore elettronici  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MT9M034 Scheda tecnica(HTML) 3 Page - ON Semiconductor

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MT9M034
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User interaction with the sensor is through the two−wire
serial bus, which communicates with the array control,
analog signal chain, and digital signal chain. The core of the
sensor is a 1.2 Mp Active− Pixel Sensor array. The timing
and control circuitry sequences through the rows of the
array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the
pixels in the row integrate incident light. The exposure is
controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the
columns is sequenced through an analog signal chain
(providing offset correction and gain), and then through an
analog−to−digital converter (ADC). The output from the
ADC is a 12−bit value for each pixel in the array. The ADC
output passes through a digital processing signal chain
(which provides further data path corrections and applies
digital gain). The sensor also offers a high dynamic range
mode of operation where multiple images are combined
on−chip to produce a single image at 20−bit per pixel value.
A compressing mode is further offered to allow this 20−bit
pixel value to be transmitted to the host system as a 12−bit
value with close to zero loss in image quality. The pixel data
are output at a rate of up to 74.25 Mp/s, in parallel to frame
and line synchronization signals.
Figure 2. Typical Configuration: Parallel Pixel Data Interface
Notes:
Master clock
(6–50 MHz)
SDATA
SCLK
RESET_BAR
TEST
FRAME_VALID
DOUT [11:0]
EXTCLK
DGND
Digital
ground
Analog
ground
To
Controller
LINE_VALID
PIXCLK
VAA_PIX
VDD_IO VDD
VDD_PLL VAA
VDD_IO
VDD
VDD_PLL
VAA
Digital I/0
Power1
Digital
Core
Power1
PLL
Power1
Analog
Power1
Analog
Power1
1. All power supplies should be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5 kΩ, but a greater value may be used for slower two-wire speed.
3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
4. ON Semiconductor recommends that 0.1 μF and 10 μF decoupling capacitors for each power supply are mounted as
close as possible to the pad. Actual values and results may vary depending on layout and design considerations.
Check the demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital
power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
SADDR
OE_BAR
TRIGGER
AGND
From
Controller
VAA_PIX
STANDBY


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