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MT9M034 Scheda tecnica(PDF) 3 Page - ON Semiconductor |
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MT9M034 Scheda tecnica(HTML) 3 Page - ON Semiconductor |
3 / 39 page MT9M034 www.onsemi.com 3 User interaction with the sensor is through the two−wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 1.2 Mp Active− Pixel Sensor array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the columns is sequenced through an analog signal chain (providing offset correction and gain), and then through an analog−to−digital converter (ADC). The output from the ADC is a 12−bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The sensor also offers a high dynamic range mode of operation where multiple images are combined on−chip to produce a single image at 20−bit per pixel value. A compressing mode is further offered to allow this 20−bit pixel value to be transmitted to the host system as a 12−bit value with close to zero loss in image quality. The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization signals. Figure 2. Typical Configuration: Parallel Pixel Data Interface Notes: Master clock (6–50 MHz) SDATA SCLK RESET_BAR TEST FRAME_VALID DOUT [11:0] EXTCLK DGND Digital ground Analog ground To Controller LINE_VALID PIXCLK VAA_PIX VDD_IO VDD VDD_PLL VAA VDD_IO VDD VDD_PLL VAA Digital I/0 Power1 Digital Core Power1 PLL Power1 Analog Power1 Analog Power1 1. All power supplies should be adequately decoupled. 2. ON Semiconductor recommends a resistor value of 1.5 kΩ, but a greater value may be used for slower two-wire speed. 3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used. 4. ON Semiconductor recommends that 0.1 μF and 10 μF decoupling capacitors for each power supply are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Check the demo headboard schematics for circuit recommendations. 5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized. 6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents. 7. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used. SADDR OE_BAR TRIGGER AGND From Controller VAA_PIX STANDBY |
Codice articolo simile - MT9M034_17 |
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Descrizione simile - MT9M034_17 |
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