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TSC87251G2D Scheda tecnica(PDF) 10 Page - TEMIC Semiconductors |
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TSC87251G2D Scheda tecnica(HTML) 10 Page - TEMIC Semiconductors |
10 / 28 page Qualpack TSC87251G2D 10 Rev 0 – October 1999 3. Qualification Product Qualification Wafer Process Qualification Package Qualification Device Type (Design) Qualification All product qualifications are split into three distinct steps as shown above. This same procedure is also used to qualify a change. Before a product is released for use, it must have been manufactured using a qualified wafer and package process. Before a device is released for production processing, it must also have successfully completed its required specific qualification. The standard tests which are used for this procedure are shown in the section "Qualification Flow" . |
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