Qualpack TSC87251G2D

10

Rev 0 – October 1999

3. Qualification

Product

Qualification

Wafer Process

Qualification

Package

Qualification

Device Type

(Design)

Qualification

All product qualifications are split into three distinct steps as shown above. This same procedure is also

used to qualify a change. Before a product is released for use, it must have been manufactured using a

qualified wafer and package process. Before a device is released for production processing, it must also

have successfully completed its required specific qualification.

The standard tests which are used for this procedure are shown in the section "Qualification Flow" .