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STPS130U Scheda tecnica(PDF) 4 Page - STMicroelectronics |
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STPS130U Scheda tecnica(HTML) 4 Page - STMicroelectronics |
4 / 7 page STPS130 4/7 Figure 11: Forward voltage drop versus forward current (maximum values) Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB) I (A) FM 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.01 0.10 1.00 10.00 V (V) FM T =25°C j T =75°C j T =125°C j 0 1 2345 0 20 40 60 80 100 120 S(Cu)(cm²) R (°C/W) th(j-a) P=1.5W 0 1 2345 0 20 40 60 80 100 120 140 S(Cu)(cm²) R (°C/W) th(j-a) P=1.5W |
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