4

TPL7407LA

SLRS073 – MAY 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the GND/substrate pin, unless otherwise noted.

(3)

(4)

The package thermal impedance is calculated in accordance with JESD 51-7.

6 Specifications

6.1 Absolute Maximum Ratings

at 25°C free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Pins OUT1-OUT7 to GND voltage

–0.3

32

V

–0.3

32

V

–0.3

32

V

–0.3

30

V

600

mA

Output clamp current

500

mA

Total continuous GND-pin current

–2

A

Operating virtual junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

6.3 Recommended Operating Conditions

Over operating temperature range

MIN

MAX

UNIT

OUT1 – OUT7 pin voltage for recommended operation

0

30

V

COM pin voltage range for full output drive

6.5

30

V

IN1- IN7 input low voltage ("Off" high impedance output)

0.9

V

IN1- IN7 input high voltage ("Full Drive" low impedance output)

1.5

V

Operating free-air temperature

–40

125

°C

Continuous drain current

0

500

mA

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPL7407LA

UNIT

TSSOP (PW)

16 PINS

Junction-to-ambient thermal resistance

113.1

°C/W

Junction-to-case (top) thermal resistance

46.5

°C/W

Junction-to-board thermal resistance

58.6

°C/W

Junction-to-top characterization parameter

7

°C/W

Junction-to-board characterization parameter

58

°C/W