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UA78L15ACLPRE3 Scheda tecnica(PDF) 4 Page - Texas Instruments |
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UA78L15ACLPRE3 Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 UA78L02A, UA78L05, UA78L05A, UA78L06A UA78L08A, UA78L09A, UA78L10A, UA78L12A, UA78L15A SLVS010V – JANUARY 1976 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: UA78L02A UA78L05 UA78L05A UA78L06A UA78L08A UA78L09A UA78L10A UA78L12A UA78L15A Submit Documentation Feedback Copyright © 1976–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage, VI UA78L02AC, UA78L05C, UA78L09C, and UA78L10AC 30 V UA78L12C, UA78L12AC, UA78L15C, and UA78L15AC 35 Virtual junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 1000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000 6.3 Recommended Operating Conditions MIN MAX UNIT VI Input voltage UA78L02AC 4.75 20 V UA78L05C and UA78L05AC 7 20 UA78L06C and UA78L06AC 8.5 20 UA78L08C and UA78L08AC 10.5 23 UA78L09C and UA78L09AC 11.5 24 UA78L10AC 12.5 25 UA78L12C and UA78L12AC 14.5 27 UA78L15C and UA78L15AC 17.5 30 IO Output current 100 mA TJ Operating virtual junction temperature UA78L00C and UA78L00AC series 0 125 °C UA78L05AI –40 125 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) UA78L00 UNIT D (SOIC) LP (TO-92) PK (SOT-89) 8 PINS 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 115 143.6 54.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 60.3 74.4 88.1 °C/W RθJB Junction-to-board thermal resistance 55.6 — 9.6 °C/W ψJT Junction-to-top characterization parameter 16.2 24.2 6.2 °C/W ψJB Junction-to-board characterization parameter 55 120.9 9.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — 7.7 °C/W |
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