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74AVC8T245DGVRE4 Scheda tecnica(PDF) 5 Page - Texas Instruments |
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74AVC8T245DGVRE4 Scheda tecnica(HTML) 5 Page - Texas Instruments |
5 / 31 page 5 SN74AVC8T245 www.ti.com SCES517J – DECEMBER 2003 – REVISED MARCH 2017 Product Folder Links: SN74AVC8T245 Submit Documentation Feedback Copyright © 2003–2017, Texas Instruments Incorporated (1) VCCI is the VCC associated with the input port. (2) VCCO is the VCC associated with the output port. (3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004. 6.3 Recommended Operating Conditions See (1) (2) (3) VCCI VCCO MIN MAX UNIT VCCA Supply voltage 1.2 3.6 V VCCB Supply voltage 1.2 3.6 V VIH High-level input voltage Data inputs 1.2 V to 1.95 V VCCI × 0.65 V 1.95 V to 2.7 V 1.6 2.7 V to 3.6 V 2 VIL Low-level input voltage Data inputs 1.2 V to 1.95 V VCCI × 0.35 V 1.95 V to 2.7 V 0.7 2.7 V to 3.6 V 0.8 VIH High-level input voltage DIR (referenced to VCCA) 1.2 V to 1.95 V VCCA × 0.65 V 1.95 V to 2.7 V 1.6 2.7 V to 3.6 V 2 VIL Low-level input voltage DIR (referenced to VCCA) 1.2 V to 1.95 V VCCA × 0.35 V 1.95 V to 2.7 V 0.7 2.7 V to 3.6 V 0.8 VI Input voltage 0 3.6 V VO Output voltage Active state 0 VCCO V 3-state 0 3.6 IOH High-level output current 1.2 V –3 mA 1.4 V to 1.6 V –6 1.65 V to 1.95 V –8 2.3 V to 2.7 V –9 3 V to 3.6 V –12 IOL Low-level output current 1.2 V 3 mA 1.4 V to 1.6 V 6 1.65 V to 1.95 V 8 2.3 V to 2.7 V 9 3 V to 3.6 V 12 Δt/Δv Input transition rise or fall rate 5 ns/V TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) SN74AVC8T245 UNIT DGV PW RHL 24 PINS 24 PINS 24 PINS RθJA Junction-to-ambient thermal resistance 95.5 92 35 °C/W RθJC(top) Junction-to-case (top) thermal resistance 27 29.3 39.9 °C/W RθJB Junction-to-board thermal resistance 48.9 46.7 13.8 °C/W ψJT Junction-to-top characterization parameter 0.7 1.5 0.3 °C/W ψJB Junction-to-board characterization parameter 48.5 46.2 13.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 1.4 °C/W |
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