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STD25P03LT4G Scheda tecnica(PDF) 1 Page - ON Semiconductor |
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STD25P03LT4G Scheda tecnica(HTML) 1 Page - ON Semiconductor |
1 / 8 page © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 5 1 Publication Order Number: NTD25P03L/D NTD25P03L, STD25P03L Power MOSFET −25 A, −30 V, Logic Level P−Channel DPAK Designed for low voltage, high speed switching applications and to withstand high energy in the avalanche and commutation modes. The source−to−drain diode recovery time is comparable to a discrete fast recovery diode. Features • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant Typical Applications • PWM Motor Controls • Power Supplies • Converters • Bridge Circuits MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS −30 V Gate−to−Source Voltage − Continuous − Non−Repetitive (tp ≤ 10 ms) VGS VGSM ±15 ±20 V Vpk Drain Current − Continuous @ TA = 25°C − Single Pulse (tp ≤ 10 ms) ID IDM −25 −75 A Apk Total Power Dissipation @ TA = 25°C PD 75 W Operating and Storage Temperature Range TJ, Tstg −55 to +150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 5.0 Vdc, Peak IL = 20 Apk, L = 1.0 mH, RG = 25 W) EAS 200 mJ Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2) RqJC RqJA RqJA 1.65 67 120 °C/W Maximum Lead Temperature for Soldering Purposes, (1/8 in from case for 10 seconds) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. When surface mounted to an FR4 board using 0.5 sq in pad size. 2. When surface mounted to an FR4 board using the minimum recommended pad size. http://onsemi.com MARKING DIAGRAM & PIN ASSIGNMENT A = Assembly Location* Y = Year WW = Work Week 25P03L = Device Code G = Pb−Free Package See detailed ordering and shipping information on page 7 of this data sheet. ORDERING INFORMATION D S G P−Channel −30 V 51 m W @ 5.0 V RDS(on) Typ −25 A ID Max V(BR)DSS 1 Gate 3 Source 2 Drain 4 Drain DPAK CASE 369C STYLE 2 1 2 3 4 * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. |
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