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STP34NM60N Scheda tecnica(PDF) 3 Page - STMicroelectronics

Il numero della parte STP34NM60N
Spiegazioni elettronici  Low gate input resistance
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DocID17740 Rev 9
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STB34NM60N, STP34NM60N
Electrical ratings
1
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
600
V
VGS
Gate-source voltage
± 25
V
ID
Drain current (continuous) at TC = 25 °C
31.5
A
ID
Drain current (continuous) at TC = 100 °C
20
A
IDM
(1)
1.
Pulse width limited by safe operating area.
Drain current (pulsed)
126
A
PTOT
Total dissipation at TC = 25 °C
250
W
IAR
Max current during repetitive or single
pulse avalanche
(pulse width limited by Tjmax )
7A
EAS
Single pulse avalanche energy
(starting TJ = 25 °C, ID=IAS, VDD= 50 V)
345
mJ
dv/dt (2)
2.
ISD ≤ 31.5 A, di/dt ≤ 400 A/µs, VDS peak ≤ V(BR)DSS, VDD = 80% V(BR)DSS
Peak diode recovery voltage slope
15
V/ns
dv/dt(3)
3.
VDS ≤ 480 V
MOSFET dv/dt ruggedness
50
V/ns
Tstg
Storage temperature
-55 to 150
°C
Tj
Max. operating junction temperature
150
°C
Table 3. Thermal data
Symbol
Parameter
Value
Unit
D2PAK
TO-220
Rthj-case
Thermal resistance junction-case max
0.5
°C/W
Rthj-amb
Thermal resistance junction-amb max
62.5
Rthj-pcb
(1)
1.
When mounted on 1 inch² FR-4, 2 Oz copper board.
Thermal resistance junction-pcb max
30


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