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HLMP-EG2E Scheda tecnica(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-EG2E Scheda tecnica(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
7 / 8 page 7 Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255 °C ± 5°C (maximum peak temperature = 260 °C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60sec Max TIME (sec) 260 °C Max 105 °C Max Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) 3,WHP3DUW1XPEHU 7/RW/RW1XPEHU /31 '0)*'DWH0DQXIDFWXULQJ'DWH 3&XVWRPHU,WHP 99HQGRU,' 'HSW,' 0DGH,Q&RXQWU\RI2ULJLQ 447<4XDQWLW\ &$7,QWHQVLW\%LQ %,15HIHUWREHORZLQIRUPDWLRQ ''DWH&RGH'DWH&RGH 67$1'$5'/$%(//6 5R+6&RPSOLDQW HPD[WHPS& |
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