2

3

1

4

5

7

13

14

15

12

9

6

11

8

10

24.725

1.3 (4x)

R0.8 (16x)

15.000

7.000

4.00

1.59

(behind mounting screw)

ITEM#

Description

Material

1

Compression Screw M10

7075-T6 Alumium Alloy

2

Socket Lid

7075-T6 Aluminum Alloy

3

Compression Plate

7075-T6 Aluminum Alloy

4

IC Frame OD 17mm ID 14mm ID 1mm R

Semitron MDS 100

5

Test Chip BGA912 17x17mm 32x32 0.5mm

Pitch

FR4 High temp

6

#0-80 Shoulder Screw, 0.062" thread length

Stainless Steel (303)

7

Socket Base SG 17mm IC 5mm Thk

7075-T6 (SN)

8

Dowel pin, 1/32" X 1/4", SS

Stainless Steel (18-8)

9

#0-80 x 0.5, SH Cap Screw

Alloy Steel

10

IC Guide

Semitron MDS 100

11

Ball Guide SM-BGA912 32x32 0.5mm

Kapton Polyimide/Cirlex

12

SM Interposer BGA912 32x32 0.5mm Pitch

SM elastomer

13

Test PCB 17x17mm 32x32 0.5mm Pitch

FR4 High temp

14

Insulation Plate

High Temp FR4

15

Backing plate for 17mm IC, 4mm thick

7075-T6 Alumium Alloy

Rev

Date

Initials Description

A

8/12/13

BJS Original

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Socket, Backing Plate Detail

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 11/20/2013

Material: N/A

Finish: N/A

Weight: 20.00

SM-BGA-9041 Drawing

SCALE: 3:1

SHEET: 4 OF 4

ENG: B. Schatz

FILE: SM-BGA-9041 Dwg

DRAWN BY: M. Raske