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BAR-95-02LS-E6327 Scheda tecnica(PDF) 6 Page - Infineon Technologies AG |
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BAR-95-02LS-E6327 Scheda tecnica(HTML) 6 Page - Infineon Technologies AG |
6 / 7 page 2006-02-03 6 BAR95... Package TSSLP-2-1 For board assembly information please refer to Infineon website "Packages" Package Outline Foot Print Marking Layout Standard Packing ±0.035 0.32 1 2 +0.01 0.31 -0.02 1) Dimension applies to plated terminal Cathode marking 1) ±0.025 0.26 Bottom view Top view 1 2 Type code Laser marking 0.43 4 0.35 Cathode marking 0.27 Copper Solder mask Stencil apertures 0.32 Reel ø180 mm = 15.000 Pieces/Reel |
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Descrizione simile - BAR-95-02LS-E6327 |
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