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LS-BGA316C-61 Scheda tecnica(PDF) 1 Page - Ironwood Electronics. |
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LS-BGA316C-61 Scheda tecnica(HTML) 1 Page - Ironwood Electronics. |
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1 / 1 page 0.2mm dia. [0.008"] 0.8mm typ. 17mm [0.669"] 17mm [0.669"] 15.2mm square [0.598"] 0.9mm [0.035"] 0.9mm [0.035"] 4.55mm [0.179"] 2.96mm [0.116"] Status: Released Drawing: Umer Qureshi Scale: 6:1 Rev: B Date: 05/21/09 Modified: 01/18/13, DH File: LS-BGA316C-61 Dwg.mcd LS-BGA316C-61 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad 2 1 1 2 Top View Side View Description: Giga-snaP BGA SMT Land Socket 316 position BGA surface mount land pattern to terminal pins (0.8mm centers, 20x20 array) RoHS RoHS |
Codice articolo simile - LS-BGA316C-61 |
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Descrizione simile - LS-BGA316C-61 |
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