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DAC38RF97IAAVR Scheda tecnica(PDF) 7 Page - Texas Instruments |
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DAC38RF97IAAVR Scheda tecnica(HTML) 7 Page - Texas Instruments |
7 / 141 page 7 DAC38RF86, DAC38RF87 DAC38RF97, DAC38RF96 www.ti.com SLASEF4 – FEBRUARY 2017 Product Folder Links: DAC38RF86 DAC38RF87 DAC38RF97 DAC38RF96 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Measured with respect to AGND or DGND. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply Voltage Range(2) VDDDAC1, VDDDIG1, VDDL1_1, VDDL2_1, VDDCLK1, VDDT1, VDDCLK1, VDDTX1, VDDE1 –0.3 1.3 V VDDR18, VDDIO18, VDDS18, VDDAPLL18, VDDOUT18, VDDA18, VDDAVCO18, VDDTX18 –0.3 2.45 V VEE18N –2 –0.5 V Voltage between AGND and DGND –0.3 0.3 V Pin Voltage Range(2) RX[0..7]+/- –0.5 VDDDIG1 + 0.5 V V SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM, RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST, TESTMODE, GPI0, GPI1, GPO0, GPO1 –0.5 VDDIO + 0.5 V V CLKOUT+/- –0.5 VDDTX18 + 0.5 V V DACCLK+/-, SYSREF+/-, DACCLKSE –0.5 VDDCLK1 + 0.5 V V SYNC0+/-, SYNC1+/- –0.5 VDDS18 + 0.5 V V VOUT1+/-, VOUT2+/- –0.5 VDDAOUT18 + 0.5 V V RBIAS, EXTIO, ATEST –0.5 VDDAOUT18 + 0.5 V V IFORCE, VSENSE –0.5 VDDDIG1 + 0.5 V V AMUX1, AMUX0 –0.5 VDDT1 + 0.5 V V Peak input current (any input) 20 mA Peak total input current (all inputs) –30 mA Junction temperature TJ 150 °C Operating free-air temperature, TA –40 85 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±250 (1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TJ Recommended operating temperature 105 °C Maximum rated operating junction temperature(1) 125 °C TA Recommended free-air temperature –40 85 °C |
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