Data Sheet

AD8003

Rev. C | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Common-Mode Input Voltage

Differential Input Voltage

Exposed Paddle Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

24-Lead LFCSP_WQ

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the AD8003 is limited

approximately 150°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the AD8003. Exceeding a junction temperature of 175°C for

an extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

quiescent power dissipation and the power dissipated in the die

due to the AD8003 drive at the output. The quiescent power is

(

)

L

2

OUT

L

OUT

S

S

S

D

R

V

–

R

V

2

V

I

V

P













×

+

×

=

(

) (

)

L

S

S

S

D

R

/

V

I

V

P

2

4

+

×

=

In addition, more metal directly in contact with the package

leads and exposed paddle from metal traces, through holes,

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the exposed paddle,

4 mm × 4 mm LFCSP_WQ (70°C/W) package on a JEDEC

0

3.0

–55

125

AMBIENT TEMPERATURE (°C)

0.5

1.0

1.5

2.0

2.5

–35

–15

5

25

45

65

85

105

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION