Substrate: 3.18mm ±0.025mm [0.125" ±0.001"] FR4/G10 or

equivalent high temp material. Non-clad.

1

2

1

2

0-80 Threaded Insert

3.18mm

[0.125"]

2.16mm

[0.085"]

1.27mm typ.

[0.050"]

2.54mm

[0.100"]

23.725mm

[0.934"]

19.05mm [0.750"]

28.725mm [1.131"]

2.71mm [0.107"]

2.50mm [0.098"]

19.05mm

[0.750"]

5.08mm

[0.200"]

2.34mm

[0.092"]

2.50mm

[0.098"]

28.725mm

[1.131"]

23.725mm [0.934"]

Ø 1.04mm typ. [Ø 0.041"]

Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm

[10µ"] Au over 1.27µm [50µ"] Ni (min.).

0.36mm typ. [0.014"]

Side View

Top View

Description: Land Socket (LS), BGA

255 position BGA surface mount land to terminal pins.

Status: Released

Drawing: H. Hansen

Scale: 3:1

Rev: A

Date: 6/25/03

Modified:

File: LS-BGA255A-G-01 Dwg

LS-BGA255A-05 Drawing

© 2003 IRONWOOD ELECTRONICS, INC.

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without

notice.