Specifications (characteristics)

Recommended soldering pattern

External dimensions

(Unit: mm)

Do not connect #2 and #3 to external device.

Internal connection

(Unit: mm)

#4

#4

#3

#1

#2

#3

#1

0.5

5.5

(0.9)

(0.9)

1.9

#2

8.0 max.

32.768k

571

E

1.3

1.3

4.2

Series resistance

MC-306

• High-density mounting-type SMD.

• Photolithography finished allows uniform and stable performance.

• Excellent reliability and environmental capability.

• 2.54mm thickness is equal to SMD-type IC.

Item

Nominal frequency

Temperature

range

Maximum drive level

Soldering condition

Frequency tolerance (standard)

Peak temperature (frequency)

Temperature coefficient (frequency)

Load capacitance

Series resistance

Motional capacitance

Shunt capacitance

Insulation resistance

Aging

Shock resistance

Symbol

f

GL

∆f/f

θT

a

IR

fa

S.R.

Specifications

32.768 kHz

20.000 kHz to 165.000 kHz

-55˚C to +125˚C

-40˚C to +85˚C

1.0µW max.

Twice at under 260˚C within 10 sec.

or under 230˚C within 3 min.

±20ppm, ±50ppm

±50ppm, ±100ppm

25˚C ±5˚C

6pF to

∞

50 k

Ω max.

55 k

Ω to 10 kΩ

1.8fF typ.

4.0fF to 0.6fF

0.9pF typ.

2.0pF to 0.6pF

500 M

Ω min.

±3ppm/Y max.

±5ppm/Y max.

±5ppm max.

Remarks

Stored as bare product after unpacking

Ta=25˚C, DL=0.1µW

Please specify

As per below table

Ta=25˚C ±3˚C, first year

Three drops on a hard board from 75 cm or excitation

test with 3000G x 0.3ms x 1/2 sine wave x 3 directions

Storage temperature

Operating temperature

Actual size

Frequency (kHz)

Series resonance

resistance (

Ω)

20

≤ f < 30

55K

Ω max.

30

≤ f < 40

45K

Ω max.

40

≤ f < 60

20K

Ω max.

60

≤ f < 70

15K

Ω max.

70

≤ f < 120

12K

Ω max.

120

≤ f < 165

10K

Ω max.

SMALL SMD LOW / MEDIUM-FREQUENCY

CRYSTAL UNIT

There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material.

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