Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

PVIN, VDD to SGND

−0.2V to +6V

PGND to SGND, PVIN to VDD

−0.2V to +0.2V

EN, EAOUT, EANEG, SYNC/MODE

to SGND

−0.2V to +6V

FB, SW

(GND −0.2V) to

(VDD +0.2V)

Storage Temperature Range

−45˚C to +150˚C

Lead Temperature

(Soldering, 10 sec.)

300˚C

Junction Temperature (Note 2)

+125˚C

Ambient Temperature Range

-25˚C to 85˚C

Minimum ESD Rating

(Human Body Model, C = 100 pF, R = 1.5 k

Ω)

Thermal Resistance (

θ

110˚C/W

Electrical Characteristics

Specifications with standard typeface are for T

Temperature Range of T

Symbol

Parameter

Conditions

Min

Typ

Max

Units

V

IN

Input Voltage Range

PVIN = VDD = V

IN (Note 4)

2.8

3.6

5.5

V

V

FB

Feedback Voltage

1.470

1.50

1.530

V

V

HYST

PFM Comparator Hysteresis

Voltage

PFM Mode (SYNC/MODE =

0V) (Note 5)

29

mV

I

SHDN

Shutdown Supply Current

VIN = 3.6V, EN = 0V

0.02

0.3

µA

I

Q1_PWM

DC Bias Current into VDD

SYNC/MODE = VIN

FB=2V

600

725

µA

I

Q2_PFM

SYNC/MODE = 0V

FB=2V

160

195

µA

R

DSON (P)

Pin-Pin Resistance for

P FET

(Note 6)

500

630

m

Ω

R

DSON (N)

Pin-Pin Resistance for

N FET

(Note 6)

420

550

m

Ω

R

DSON (TC)

FET Resistance

Temperature Coefficient

0.5

%/C

I

LIM

Switch Peak Current Limit

(Note 7)

620

850

1100

mA

V

IH

Logic High Input, EN,

SYNC/MODE

0.95

1.3

V

V

IL

Logic Low Input, EN,

SYNC/MODE

0.4

0.80

V

F

SYNC

SYNC/MODE Clock

Frequency Range

(Note 8)

500

1000

kHz

F

OSC

Internal Oscillator

Frequency

PWM Mode

468

640

800

kHz

T

min

Minimum ON-Time of PFET

Switch in PWM Mode

200

ns

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions

in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25˚C and are not guaranteed.

Note 2: Thermal shutdown will occur if the junction temperature exceeds 150˚C.

Note 3: Thermal resistance specified with 4" x 3" JEDEC (2 layer 2 oz Cu.) board.

Note 4: The LM2619MTC is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be

kept in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.

Note 5: The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch

on and then off during PFM mode. When resistor dividers are used like in the operating circuit of Figure 4, the hysteresis at the output will be the value of the

hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k).

Note 7: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch

turns off for 2.5µs to allow the inductor current to diminish.

the external clock frequency. The LM2619MTC synchronizes to the rising edge of the external clock.

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