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LM2647LQ Scheda tecnica(PDF) 7 Page - National Semiconductor (TI) |
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LM2647LQ Scheda tecnica(HTML) 7 Page - National Semiconductor (TI) |
7 / 25 page Electrical Characteristics (Continued) Specifications with standard typeface are for T J = 25˚C, and those with boldface apply over full Operating Junction Tempera- ture range. VDD = V5 = 5V, V SGND =VPGND = 0V, VIN = 15V, VEN = 3V, RFADJ = 22.1K unless otherwise stated. (Note 5) Symbol Parameter Conditions Min (Note 6) Typical (Note 7) Max (Note 6) Units V SW_ZERO Zero-cross Threshold (SW Pin) LDRV goes low -2.2 mV Osillator PWM Frequency R FADJ = 22.1k Ω 255 300 345 kHz R FADJ = 12.4k Ω 500 R FADJ = 30.9k Ω 200 PWM Ramp Peak-to-peak Amplitude VIN = 15V 1.6 V VIN = 24V 2.95 PWM Ramp Valley 0.8 V Frequency Change with VIN VIN = 5.5V to 24V ±1% Frequency Change with VDD VDD = 4.5V to 5.5V ±2% Phase Shift Between Channels Phase from HDRV1 to HDRV2 165 180 195 deg FREQ Pin Voltage vs. VIN 0.105 V/V System Minimum ON Time V FPWM =3V 30 ns VIN = 5.5V 60 75 % Maxmimum Duty Cycle VIN = 15V 40 50 % VIN = 28V, VDD= 4.5V 22 28 % Gate Drivers HDRV Source Impedance HDRV Pin Current (sourcing)= 1.2A 7 Ω HDRV Sink Impedance HDRV Pin Current (sinking) = 1A 2 Ω LDRV Source Impedance LDRV Pin Current (sourcing) = 1.2A 7 Ω LDRV Sink Impedance LDRV Pin Current (sinking) = 2A 1 Ω Cross-conduction protection delay (deadtime) HDRV Falling to LDRV Rising 40 ns LDRV Falling to HDRV Rising 70 Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. Note 2: PGND1, PGND2 and SGND are all electrically connected together on the PCB. Note 3: The maximum allowable power dissipation is calculated by using PDmax =(TJMAX -TA)/θJA , where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance of the specified package. The 1.0W rating of the TSSOP-28 package for example results from using 125˚C, 25˚C, and 97˚C/W for TJMAX,TA, and θJA respectively. The 2.85W rating of the 28-pin LLP package results from using 125˚C, 25˚C, and 35˚C/W for TJMAX,TA, and θJA respectively. The rated power dissipation should be derated by 10mW/˚C above 25˚C ambient for the TSSOP package and 29mW/˚C above 25˚C ambient for the LLP package. The θJA value above represents the worst-case condition with no heat sinking. Heat sinking will permit more power to be dissipated at higher ambient temperatures. For detailed information on soldering plastic TSSOP and LLP packages, refer to http://www.national.com/packaging/. Note 4: ESD is applied by the human body model, which is a 100pF capacitor discharged through a 1.5 k Ω resistor into each pin. Note 5: RFADJ is the frequency adjust resistor between FREQ pin and Ground. Note 6: All limits are guaranteed at room temperature (standard face type) and at temperature extremes (bold face type). All room temperature limits are 100% production tested. All limits at temperature extremes are guaranteed via correlation using Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 7: Typical numbers are at 25˚C and represent the most likely norm. Note 8: If the LM2647 starts up with a pre-charged soft start capacitor, it will first discharge the capacitor to VSS_RESET and then begin the normal Soft-start process. www.national.com 7 |
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