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LM2630 Scheda tecnica(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Il numero della parte LM2630
Spiegazioni elettronici  Synchronous Step-Down Power Supply Controller
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Produttore elettronici  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2630 Scheda tecnica(HTML) 4 Page - National Semiconductor (TI)

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Electrical Characteristics (Continued)
Specifications in standard type face are for T
j = 25˚C and those with boldface type apply over full operating junction tem-
perature range. V
IN =10V, GND = PGND = 0V,unless otherwise stated. (Notes 5, 6)
Symbol
Parameter
Conditions
Typical
Limit
Units
Voltage Reference
V
REF
Reference Voltage (Line
Regulation)
4.5V < V
IN < 30V
1.238
V
1.213/1.208
V(min)
1.263/1.268
V(max)
Reference Voltage (Load
Regulation)
0µA < I
REF < 50 µA
1.238
V
1.213/1.208
V(min)
1.263/1.268
V(max)
Logic Inputs and Outputs
V
IH
Minimum High Level Input
Voltage (SD, FPWM and
SYNC)
2.4
V(min)
V
IL
Maximum Low Level Input
Voltage (FPWM and SYNC)
0.8
V(max)
Maximum Low Level Input
Voltage (SD)
0.5
V(max)
Maximum Input Leakage
Curren1t (SD , FPWM and
SYNC)
Logic Input Voltage 0V or 5V
±0.1
µA
V
OH
PGOOD High Level Output
Voltage
PGOOD Sourcing 50 µA
2.7
V
2.4
V(min)
V
OL
PGOOD Low Level Output
Voltage
PGOOD Sinking 50 µA
0
V
0.5
V(max)
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated operating conditions.
Note 2: The maximum allowable power dissipation is calculated by using PDmax = (TJmax -TA)/θJA , where TJmax is the maximum junction temperature, TA is the
ambient temperature, and
θJA is the junction-to-ambient thermal resistance of the specified package. The 720 mW rating results from using 160˚C, 70˚C, and
125˚C/W for TJmax,TA, and θJA respectively. A θJA of 125˚C/W represents the worst-case condition of no heat sinking of the 20-pin TSSOP. Heat sinking allows the
safe dissipation of more power. The Absolute Maximum power dissipation must be derated by 8 mW per ˚C above 70˚C ambient. The LM2630 actively limits its junc-
tion temperature to about 160˚C.
Note 3: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.
Note 4: For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 k
Ω resistor.
Note 5: A typical is the center of characterization data taken with TA = TJ = 25˚C. Typicals are not guaranteed.
Note 6: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25˚C. All hot and cold limits
are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 7: This limit is guaranteed by design.
Note 8: Pulling 2.94 µA out of FADJ pin simulates adjusting the oscillator frequency with a 350 k
Ω resistor connected from FADJ to GND.
www.national.com
4


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