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BU2152FS-E2 Scheda tecnica(PDF) 8 Page - Rohm |
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BU2152FS-E2 Scheda tecnica(HTML) 8 Page - Rohm |
8 / 16 page 8/12 BU2152FS TSZ02201-0RHR1GZ00150-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 24.Aug.2015 Rev.002 www.rohm.com TSZ22111・15・001 I/O Equivalence Circuits P1 to P24 SO Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be estimated by this thermal resistance. Figure 6 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below: θJA = (TJmax - TA) / PD (°C/W) Derating curve in Figure 7 indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 7. Derating curve of BU2152FS 85 P1 to P24 VDD DATA,CLK,STB,CLB VSS DATA CLK STB CLB VDD VDD VSS VSS VDD VSS VDD VSS VSS VDD SO VDD VSS VDD VSS VSS Figure 6. Thermal resistance θJA=(TJmax- TA)/ PD [°C/W] [°C] [°C] Ambient temperature TA (°C) Chip surface temperature TJ(°C) Power dissipation PD (W) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 Ambient Temperature [°C] |
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