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LM2793LDX Scheda tecnica(PDF) 9 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Il numero della parte LM2793LDX
Spiegazioni elettronici  Low Noise White LED Constant Current Supply with Dual Function Brightness Control
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Produttore elettronici  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2793LDX Scheda tecnica(HTML) 9 Page - National Semiconductor (TI)

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Application Information (Continued)
T
J =TA +(PDMAX x
θ
JA)
= 85˚C + (0.149W x 55˚C/W)
= 93˚C
The junction temperature rating takes precedence over the
ambient temperature rating. The LM2793 may be operated
outside the ambient temperature rating, so long as the junc-
tion temperature of the device does not exceed the maxi-
mum operating rating of 100˚C. The maximum ambient tem-
perature rating must be derated in applications where high
power dissipation and/or poor thermal resistance causes the
junction temperature to exceed 100˚C.
PCB Layout Considerations
The LLP is a leadframe based Chip Scale Package (CSP)
with very good thermal properties. This package has an
exposed DAP (die attach pad) at the center of the package
measuring 2.0mm x 1.2mm. The main advantage of this
exposed DAP is to offer lower thermal resistance when it is
soldered to the thermal land on the PCB. For PCB layout,
National highly recommends a 1:1 ratio between the pack-
age and the PCB thermal land. To further enhance thermal
conductivity, the PCB thermal land may include vias to a
ground plane. For more detailed instructions on mounting
LLP packages, please refer to National Semiconductor Ap-
plication Note AN-1187.
www.national.com
9


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