LC898124EP1XC

www.onsemi.com

3

Application Diagram

Package Dimensions

unit : mm

Lens

VCM

Hall

Sensor

LC898124EP1XC

EEPROM

Digital

Gyro

I C

SPI

OIS/OP-AF

Actuator

Camera Module

CMOS

Sensor

AP/ISP

Position

(OIS)

Digital

Gyro

OIS/AF Driver

2

WLCSP27, 3.89x1.30, 0.4P

CASE 567NJ

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

MILLIMETERS

D

3.89 BSC

E

b

0.12

0.22

e

0.40 BSC

0.33

D

E

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.08 C

27X

b

4

C

B

A

0.13 C

A1

C

1.30 BSC

0.17

27X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.40

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

RECOMMENDED

PACKAGE

OUTLINE

123

PITCH

PITCH

A1

A

DETAIL A

DIE

COAT

DETAIL A

56

7

89

A1

0.04 REF