LB1860, LB1860M, LB1861, LB1861M

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7

Package Dimensions

unit : mm

[LB1860M, LB1861M]

SOIC14 W / MFP14S (225 mil)

CASE 751CB

ISSUE A

SOLDERING FOOTPRINT*

NOTE: The measurements are not to guarantee but for reference only.

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

(Unit: mm)

0.47

1.00

XXXXX = Specific Device Code

Y = Year

M = Month

DDD = Additional Traceability Data

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer to

device data sheet for actual part marking.

XXXXXXXXXX

YMDDD

to