www.ti.com

FEATURES

Seemechanicaldrawingsfordimensions.

DCTPACKAGE

(TOP VIEW)

DCUPACKAGE

(TOP VIEW)

1

V

CC

8

1OE

2

7

1A

2OE

3

6

2Y

1Y

4

5

GND

2A

3

6

1Y

2Y

8

1

V

CC

1OE

5

GND

4

2A

2

7

2OE

1A

GND

5

4

2A

3 6

1Y

2Y

2 7

2OE

1A

8

V

CC

1

1OE

YZP PACKAGE

(BOTTOMVIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G240

DUAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

SCES208H – APRIL 1999 – REVISED FEBRUARY 2007

• Available in the Texas Instruments

• Typical V

NanoFree™ Package

V

• Supports 5-V V

• I

Operation

• Inputs Accept Voltages to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

• Max t

JESD 78, Class II

• Low Power Consumption, 10-µA Max I

CC

• ESD Protection Exceeds JESD 22

• ±24-mA Output Drive at 3.3 V

–

2000-V Human-Body Model (A114-A)

• Typical V

–

1000-V Charged-Device Model (C101)

at V

The SN74LVC2G240 is designed specifically to improve the performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74LVC2G240YZPR

_ _ _CK_

(Pb-free)

–40

°C to 85°C

SSOP – DCT

Reel of 3000

SN74LVC2G240DCTR

C40_ _ _

VSSOP – DCU

Reel of 3000

SN74LVC2G240DCUR

C40_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.