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Motore di ricerca datesheet componenti elettronici |
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BAP70-02 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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BAP70-02 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page  2002 Aug 06 3 Philips Semiconductors Product specification Silicon PIN diode BAP70-02 THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rth j-s thermal resistance from junction to soldering point 145 K/W GRAPHICAL DATA handbook, halfpage 103 102 10 1 MCE007 10−1 110 rD ( Ω) IF (mA) 102 Fig.2 Forward resistance as a function of forward current; typical values. f = 100 MHz; Tj =25 °C. handbook, halfpage 05 10 Cd (fF) 20 VR (V) 600 0 200 400 500 100 300 15 MCE008 Fig.3 Diode capacitance as a function of reverse voltage; typical values. f = 1 MHz; Tj =25 °C. |
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