2000 Jun 09

5

Philips Semiconductors

Product specification

Magnetic Field Sensor

KMZ52

5.

.

6. Resistance of compensation coil die 1: between pins 6 and 7;

resistance of compensation coil die 2: between pins 4 to 13.

7. Resistance of set/reset coil die 1: between pins 10 and 11;

resistance of set/reset coil die 2: between pins 1 to 16.

8. Isolating resistance die 1: pins 7 and 8, 7 and 10 and 8 to 10;

isolating resistance die 2: pins 1 to 2, 1 to 4 and 2 to 4.

9. Angle die-to-die: die 2 is turned by 90

±2 degrees in anticlockwise direction with respect to die 1;

angle dice-to-package: both dice in their fixed die-to-die position are tilted towards the package edges by

0

±5 degrees.

TCV

offset

V

offset T

2

()

V

offset T

1

()

–

T

2

T

1

–

()

---------------------------------------------------------

=

Where T

1

25

°CT

2

125

°C

=

;

–

=