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TPD6F002-Q1 Scheda tecnica(PDF) 4 Page - Texas Instruments |
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TPD6F002-Q1 Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 19 page TPD6F002-Q1 SLLSEK0A – DECEMBER 2014 – REVISED FEBRUARY 2015 www.ti.com 7.4 Thermal Information TPD6F002-Q1 THERMAL METRIC(1) DSV UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 120.7 RθJC(top) Junction-to-case (top) thermal resistance 104.4 RθJB Junction-to-board thermal resistance 78.5 °C/W ψJT Junction-to-top characterization parameter 13.0 ψJB Junction-to-board characterization parameter 77.7 RθJC(bot) Junction-to-case (bottom) thermal resistance 66.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics TA = –40°C to 125°C (Unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VBR DC breakdown voltage IIO = 10 μA 6 V R Resistance VIN = 3.3 V, IIn-to-out = 1mA 85 100 115 Ω C Capacitance (C1 or C2) VIO = 2.5 V 17 pF IIO Channel leakage current VIO = 3.3 V 1 20 nA fC Cut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω 100 MHz (1) Typical values are at TA = 25°C. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: TPD6F002-Q1 |
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