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TL103WIDRG4 Scheda tecnica(PDF) 11 Page - Texas Instruments |
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TL103WIDRG4 Scheda tecnica(HTML) 11 Page - Texas Instruments |
11 / 16 page www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] 8X (.055) [1.4] 8X (.024) [0.6] 6X (.050 ) [1.27] (.217) [5.5] SOIC SOIC - 1.75 mm max height D0008B 4221445/B 04/2014 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. HV / ISOLATION OPTION .162 [4.1] CLEARANCE / CREEPAGE BASED ON .005 INCH [0.127 MM] THICK STENCIL SOLDER PASTE EXAMPLE SCALE:6X SYMM SYMM 1 4 5 8 IPC-7351 NOMINAL .150 [3.85] CLEARANCE / CREEPAGE SYMM SYMM 1 4 5 8 11 TL103W, TL103WA www.ti.com SLOS437L – APRIL 2004 – REVISED FEBRUARY 2016 Product Folder Links: TL103W TL103WA Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated |
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