TL720M05-Q1

SGLS380H – SEPTEMBER 2008 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–42

45

V

Output voltage

–1

40

V

Operating virtual-junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±6000

V

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

5.5

42

V

Operating free-air temperature

–40

125

°C

Operating virtual-junction temperature

–40

150

°C

6.4 Thermal Information

TL720M05-Q1

KTT

KVU

PWP

UNIT

(TO-263)

(TO-252)

(HTSSOP)

3 PINS

3 PINS

20 PINS

Junction-to-ambient thermal resistance

34.2

45.3

39.3

°C/W

Junction-to-case (top) thermal resistance

38.2

36.8

22.7

°C/W

Junction-to-board thermal resistance

44.9

30.8

19.1

°C/W

Junction-to-top characterization parameter

6

2.8

0.6

°C/W

Junction-to-board characterization parameter

44.5

30.2

18.9

°C/W

Junction-to-case (bottom) thermal resistance

0.8

0.7

1.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953

4

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