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74LVC1G3157DRLRG4 Scheda tecnica(PDF) 4 Page - Texas Instruments

Il numero della parte 74LVC1G3157DRLRG4
Spiegazioni elettronici  SN74LVC1G3157 Single-Pole Double-Throw Analog Switch
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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SN74LVC1G3157
SCES424J – JANUARY 2003 – REVISED JUNE 2016
www.ti.com
Product Folder Links: SN74LVC1G3157
Submit Documentation Feedback
Copyright © 2003–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground unless otherwise specified.
(3)
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
This value is limited to 5.5 V maximum.
(5)
VI, VO, VA, and VBn are used to denote specific conditions for VI/O.
(6)
II, IO, IA, and IBn are used to denote specific conditions for II/O.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage(2)
–0.5
6.5
V
VIN
Control input voltage(2)(3)
–0.5
6.5
V
VI/O
Switch I/O voltage(2)(3)(4)(5)
–0.5
VCC + 0.5
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/O
I/O port diode current
VI/O < 0 or VI/O > VCC
±50
mA
II/O
On-state switch current(6)
VI/O = 0 to VCC
±128
mA
Continuous current through VCC or GND
±100
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
(1)
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
1.65
5.5
V
VI/O
Switch input or output voltage
0
VCC
V
VIN
Control input voltage
0
5.5
V
VIH
High-level input voltage, control input
VCC = 1.65 V to 1.95 V
VCC × 0.75
V
VCC = 2.3 V to 5.5 V
VCC × 0.7
VIL
Low-level input voltage, control input
VCC = 1.65 V to 1.95 V
VCC × 0.25
V
VCC = 2.3 V to 5.5 V
VCC × 0.3
Δt/Δv
Input transition rise or fall rate
VCC = 1.65 V to 1.95 V
20
ns/V
VCC = 2.3 V to 2.7 V
20
VCC = 3 V to 3.6 V
10
VCC = 4.5 V to 5.5 V
10
TA
Operating free-air temperature
–40
85
°C


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