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LM3561 Scheda tecnica(PDF) 3 Page - Texas Instruments |
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LM3561 Scheda tecnica(HTML) 3 Page - Texas Instruments |
3 / 37 page LM3561 www.ti.com SNOSB44C – MARCH 2011 – REVISED MAY 2013 Table 2. Pin Descriptions Name Pin Description GND A1 Ground IN A2 Input Voltage Connection. Connect IN to the input supply and bypass to GND with a minimum 10µF ceramic capacitor. HWEN A3 Active Low Hardware Reset Input. This input is high impedance and cannot be left floating. Typically this would be tied to a pullup resistor and to a logic high voltage, or VIN, in order to enable the LM3561. SW B1 Drain Connection for Internal NMOS and Synchronous PMOS Switches STROBE Active High Hardware Flash Enable. Drive STROBE high to turn on the Flash pulse. STROBE has an B2 internal 300k Ω pulldown to GND. SCL B3 Serial Clock Input. OUT C1 Step-Up DC/DC Converter Output. Bypass OUT to GND with a 10µF Ceramic Capacitor. TX1/TORCH/GPIO C2 Configurable as a Flash Interrupt Input, a Hardware Torch Enable, or a Programmable General Purpose Logic Input/Output. This pin has an internal 300k Ω pulldown to GND. SDA C3 Serial Data Input/Output. LED D1 High Side Current Source Output for Flash LED. Configurable as a High Side Current Source Output for Indicator LEDs or as a Threshold Detector for LEDI/NTC D2 LED Temperature Sensing. Configurable as a Flash Interrupt Input, a Programmable General Purpose Logic Input/Output, or as an TX2/GPIO2/INT D3 Interrupt output for fault notification. This pin has an internal 300k Ω pulldown to GND. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) VIN, VSW, VOUT -0.3V to 6V VSCL, VSDA, VHWEN, VSTROBE, VTX1, VTX2, VLED, VLEDI/NTC -0.3V to (VIN+0.3V) w/ 6.0V max Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range -65°C to +150°C Maximum Lead Temperature (Soldering) See (5) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and disengages at TJ=135ºC (typ.). (5) For detailed soldering specifications and information, see Application Note 1112: Micro SMD Wafer Level chip Scale Package SNVA009 Operating Ratings (1) (2) VIN 2.5V to 5.5V Junction Temperature (TJ) -40°C to +125°C Ambient Temperature (TA) (3) -40°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3561 |
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