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LM3557 Scheda tecnica(PDF) 2 Page - Texas Instruments

Il numero della parte LM3557
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LM3557
SNVS338B – NOVEMBER 2004 – REVISED FEBRUARY 2013
www.ti.com
Connection Diagram
Figure 2. 8-Lead Thin WSON Package
(Top View)
PIN DESCRIPTIONS
Name
Pin No.
Description
Sw1
1
Drain Connection of the Internal Power Field Effect Transistor (FET) Switch (Figure 3: N1)
VIN
2
Input Voltage Connection
NC
3
No Connection
En
4
Device Enable Connection
Ovp
5
Over-Voltage Protection Input Connection
Fb
6
Feedback Voltage Connection
Sw2
7
Drain Connection of an Internal Field Effect Transistor (FET) Switch (Figure 3: N2)
Gnd
8
Ground Connection
DAP
DAP
Die Attach Pad (DAP), must be soldered to the printed circuit board's ground plane for enhanced thermal dissipation
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
VIN Pin
−0.3V to +8V
En Pin
−0.3V to +8V
Fb Pin
−0.3V to +8V
Sw2 Pin
−0.3V to +8V
Ovp Pin
−0.3V to +30V
Sw1 Pin
−0.3V to +40V
Continuous Power Dissipation
Internally Limited
Maximum Junction Temperature
(TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
ESD Rating (3)
Human Body Model
2 kV
Machine Model
150V
(1)
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(3)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
2
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Copyright © 2004–2013, Texas Instruments Incorporated
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