LM3370 datasheet(7/33 Pages) TI1

Il numero della parte	LM3370

Spiegazioni elettronici	Dual Synchronous Step-Down DC-DC Converter

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LM3370

www.ti.com

SNVS406N – NOVEMBER 2005 – REVISED MAY 2013

Thermal Properties

(1)

Junction-to-Ambient Thermal Resistance

θJA (WSON-16)

26°C/W

θJA (20-Bump DSBGA)

50°C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array

of thermal vias. Thickness of copper layers are 2/1/1/2oz. Junction-to-ambient thermal resistance is highly application and board-layout

dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in

board design.The value of

θJA of this product can vary significantly, depending on PCB material, layout, and environmental conditions. In

applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues.

For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) (SNOA401).

Electrical Characteristics

(1) (2) (3)

Typical limits appearing in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the entire junction

temperature range (TA = TJ = −30°C to +85°C). Unless otherwise noted, VIN1 = VIN2 = 3.6V.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

VFB

Feedback Voltage

(4)

−3.5

+3.5

%

VOUT

Line Regulation

2.7V

≤ VIN ≤ 5.5V

0.031

%/V

IO = 10 mA, VOUT = 1.8V

Load Regulation

100 mA

≤ IO ≤ 600 mA

0.0013

%/mA

VIN = 3.6V, VOUT = 1.8V

IQ PFM

Quiescent Current “On”

PFM Mode, Both Bucks ON

34

µA

IQ SD

Quiescent Current “Off”

EN1 = EN2 = 0V

0.2

3

µA

ILIM

Peak Switching Current Limit

VIN = 3.6V

850

1200

1400

mA

RDS_ON

PFET

VIN = 3.6V, ISW = 200 mA

390

500

m

Ω

(WSON)

NFET

VIN = 3.6V, ISW = 200 mA

240

350

RDS_ON

PFET

VIN = 3.6V, ISW = 200 mA

350

400

m

Ω

(DSBGA)

NFET

VIN = 3.6V, ISW = 200 mA

170

210

FOSC

Internal Oscillator Frequency

1.5

2.0

2.4

MHz

IEN

Enable (EN) Input Current

0.01

1

µA

VIL

Enable Logic Low

0.4

V

VIH

Enable Logic High

1.0

V

POWER ON RESET THRESHOLD/FUNCTION (POR)

nPOR1 and

nPOR1 = Power ON Reset

50 mS (default)

nPOR2

for Buck 1

50

mS

Delay Time

nPOR2 = Power ON Reset

Can be pre-trimmd to 50 uS, 100

for Buck 2

mS and 200 mS

POR

Percentage of Target VOUT

VOUT Rising

94

Threshold

%

VOUT Falling, 85% (default), Can be

85

pre-trimmed to 70% or 94%

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Min. and Max are specified by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are

tested during production with TJ = 25°C. All hot and cold limits are ensured by correlating the electrical characteristics to process and

temperature variations and applying statistical process control.

(3)

Input voltage range for all voltage options is 2.7V to 5.5V. The voltage range recommended for the specified output voltages: VIN = 2.7V

to 5.5V for 1V

≤ VOUT ≤ 1.7V and for VOUT = 1.8V or greater, VIN = VOUT + 1VorVIN,MIN = ILOAD * (RDSON_PFET + RDCR_INDUCTOR) + VOUT

(4)

Test condition: for VOUT less than 2.5V, VIN = 3.6V; for VOUT greater than or equal to 2.5V, VIN = VOUT + 1V.

Dissipation Rating Table

θJA

TA = 60°C

TA = 85°C

Power Rating

26°C/W (4-Layer Board) WSON-16

1538 mW

50°C/W (4-Layer Board) 20-bump DSBGA

1300 mW

800 mW

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