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LM2704 Scheda tecnica(PDF) 2 Page - Texas Instruments |
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LM2704 Scheda tecnica(HTML) 2 Page - Texas Instruments |
2 / 19 page LM2704 SNVS175D – FEBRUARY 2002 – REVISED MAY 2013 www.ti.com Connection Diagram The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction- to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. Figure 1. SOT23-5 - Top View TJmax = 125°C, θJA = 220°C/W PIN DESCRIPTIONS Pin Name Function 1 SW Power Switch input. 2 GND Ground. 3 FB Output voltage feedback input. 4 SHDN Shutdown control input, active low. 5 VIN Analog and Power input. SW(Pin 1): Switch Pin. This is the drain of the internal NMOS power switch. Minimize the metal trace area connected to this pin to minimize EMI. GND(Pin 2): Ground Pin. Tie directly to ground plane. FB(Pin 3): Feedback Pin. Set the output voltage by selecting values for R1 and R2 using: (1) Connect the ground of the feedback network to an AGND plane which should be tied directly to the GND pin. SHDN(Pin 4): Shutdown Pin. The shutdown pin is an active low control. Tie this pin above 1.1V to enable the device. Tie this pin below 0.3V to turn off the device. VIN(Pin 5): Input Supply Pin. Bypass this pin with a capacitor as close to the device as possible. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM2704 |
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