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LM2704 Scheda tecnica(PDF) 2 Page - Texas Instruments

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Il numero della parte LM2704
Spiegazioni elettronici  LM2704 Micropower Step-up DC/DC Converter with 550mA Peak Current Limit
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LM2704
SNVS175D – FEBRUARY 2002 – REVISED MAY 2013
www.ti.com
Connection Diagram
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-
to-ambient thermal resistance,
θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the
thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD
(MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die
temperature.
Figure 1. SOT23-5 - Top View
TJmax = 125°C, θJA = 220°C/W
PIN DESCRIPTIONS
Pin
Name
Function
1
SW
Power Switch input.
2
GND
Ground.
3
FB
Output voltage feedback input.
4
SHDN
Shutdown control input, active low.
5
VIN
Analog and Power input.
SW(Pin 1): Switch Pin. This is the drain of the internal NMOS power switch. Minimize the metal trace area
connected to this pin to minimize EMI.
GND(Pin 2): Ground Pin. Tie directly to ground plane.
FB(Pin 3): Feedback Pin. Set the output voltage by selecting values for R1 and R2 using:
(1)
Connect the ground of the feedback network to an AGND plane which should be tied directly to the GND pin.
SHDN(Pin 4): Shutdown Pin. The shutdown pin is an active low control. Tie this pin above 1.1V to enable the
device. Tie this pin below 0.3V to turn off the device.
VIN(Pin 5): Input Supply Pin. Bypass this pin with a capacitor as close to the device as possible.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Copyright © 2002–2013, Texas Instruments Incorporated
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