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CD74FCT541EE4 Scheda tecnica(PDF) 1 Page - Texas Instruments |
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CD74FCT541EE4 Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 12 page CD74FCT541 BiCMOS OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS SCBS741 – JULY 2000 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D BiCMOS Technology With Low Quiescent Power D Buffered Inputs D Noninverted Outputs D Input/Output Isolation From VCC D Controlled Output Edge Rates D 64-mA Output Sink Current D Output Voltage Swing Limited to 3.7 V D SCR Latch-Up-Resistant BiCMOS Process and Circuit Design D Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP description The CD74FCT541 is an octal buffer/driver with 3-state outputs that is ideal for driving bus lines or buffer memory address registers and uses a small-geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 64 mA. The 3-state control gate is a two-input AND gate with active-low inputs, so that if either output-enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state. The outputs provide noninverted data when they are not in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The CD74FCT541 is characterized for operation from 0 °C to 70°C. FUNCTION TABLE (each buffer/driver) INPUTS OUTPUT OE1 OE2 A Y L L L L L LH H H XX Z X H X Z Copyright © 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 E, M, OR SM PACKAGE (TOP VIEW) |
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