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SN74CB3T3306DCTR Scheda tecnica(PDF) 11 Page - Texas Instruments |
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SN74CB3T3306DCTR Scheda tecnica(HTML) 11 Page - Texas Instruments |
11 / 19 page 0.0 1.0 2.0 3.0 4.0 VI - Input Voltage - V 0.0 1.0 2.0 3.0 4.0 5.0 6.0 VCC = 3 V IO = 1 µA TA = 25 C ° VI - Input Voltage - V 0.0 1.0 2.0 3.0 4.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 VCC = 2.3 V IO = 1 µA TA = 25 C ° SN74CB3T3306 www.ti.com SCDS119C – JANUARY 2003 – REVISED DECEMBER 2015 Typical Application (continued) 9.2.3 Application Curves Figure 9. Data Output Voltage vs Data Input Voltage Figure 10. Data Output Voltage vs Data Input Voltage 10 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, a 0.1- μF bypass capacitor is recommended. If there are multiple pins labeled VCC, then a 0.01-μF or 0.022- μF capacitor is recommended for each VCC because the VCC pins will be tied together internally. For devices with dual supply pins operating at different voltages, for example VCC and VDD, a 0.1-µF bypass capacitor is recommended for each supply pin. It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise. 0.1- μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 11 Layout 11.1 Layout Guidelines Reflections and matching are closely related to the loop antenna theory but are different enough to be discussed separately from the theory. When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must turn corners. Figure 11 shows progressively better techniques of rounding corners. Only the last example (BEST) maintains constant trace width and minimizes reflections. Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: SN74CB3T3306 |
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