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SSA210 Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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SSA210 Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page © 2015 Fairchild Semiconductor Corporation www.fairchildsemi.com SSA210 Rev. 1.1 2 Thermal Characteristics(1) Values are at TA = 25°C unless otherwise noted. Note: 1. Per JESD51-3 recommended thermal test board. Device mounted on FR-4 PCB, board size = 76.2 mm x 114.3 mm. 2. Thermocouple soldered at cathode lead. Electrical Characteristics Values are at TA = 25°C unless otherwise noted. Note: 3. Pulse test with Pulse width = 300 μs, 1% duty cycle. Symbol Parameter Value Unit ψJL Typical Thermal Characteristics, Junction-to-Lead(2) 30 °C/W RθJA Typical Thermal Resistance, Junction-to-Ambient 180 °C/W Symbol Parameter Conditions Min. Typ. Max. Unit VF Forward Voltage(3) IF = 2.0 A 0.8 V IR Reverse Current VR = 100 V 0.05 mA VR = 100 V, TA = 100°C 20 Trr Reverse Recovery Time IF = 0.5 A, IR = 1 A, Irr = 0.25 A 8.02 ns |
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