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TLP665LF Scheda tecnica(PDF) 8 Page - Toshiba Semiconductor |
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TLP665LF Scheda tecnica(HTML) 8 Page - Toshiba Semiconductor |
8 / 18 page TLP665L,TLP665LF 8 13. 13. 13. 13. Soldering and Storage Soldering and Storage Soldering and Storage Soldering and Storage 13.1. 13.1. 13.1. 13.1. Precautions for Soldering Precautions for Soldering Precautions for Soldering Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow (see following figures) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. Fig. Fig. Fig. 13.1.1 13.1.1 13.1.1 13.1.1 An Example of a Temperature An Example of a Temperature An Example of a Temperature An Example of a Temperature Profile When Sn-Pb Eutectic Solder Is Used Profile When Sn-Pb Eutectic Solder Is Used Profile When Sn-Pb Eutectic Solder Is Used Profile When Sn-Pb Eutectic Solder Is Used Fig. Fig. Fig. Fig. 13.1.2 13.1.2 13.1.2 13.1.2 An Example of a Temperature An Example of a Temperature An Example of a Temperature An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used Profile When Lead(Pb)-Free Solder Is Used Profile When Lead(Pb)-Free Solder Is Used Profile When Lead(Pb)-Free Solder Is Used • When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. 13.2. 13.2. 13.2. Precautions for General Storage Precautions for General Storage Precautions for General Storage Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 2014-11-07 Rev.1.0 |
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