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LM2852YMXAX-1.2 Scheda tecnica(PDF) 4 Page - Texas Instruments |
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LM2852YMXAX-1.2 Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 27 page LM2852 SNVS325E – JANUARY 2005 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT PVIN, AVIN, EN, SNS 6.5 V Power dissipation Internally limited Infrared (15 sec) 220 °C 14-Pin exposed pad HTSSOP package Vapor phase (60 sec) 215 °C Maximum junction temperature 150 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT PVIN to GND 1.5 5.5 V AVIN to GND 2.85 5.5 V Junction temperature −40 125 °C 6.4 Thermal Information LM2852 THERMAL METRIC(1) PWP (HTTSOP) UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 39.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 24.1 °C/W RθJB Junction-to-board thermal resistance 20.1 °C/W ψJT Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 19.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LM2852 |
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