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IRF9540S Scheda tecnica(PDF) 1 Page - Kersemi Electronic Co., Ltd.

Il numero della parte IRF9540S
Spiegazioni elettronici  Available in Tape and Reel
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Produttore elettronici  KERSEMI [Kersemi Electronic Co., Ltd.]
Homepage  http://www.kersemi.com
Logo KERSEMI - Kersemi Electronic Co., Ltd.

IRF9540S Scheda tecnica(HTML) 1 Page - Kersemi Electronic Co., Ltd.

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IRF9540S, SiHF9540S
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• P-Channel
• 175 °C Operating Temperature
•Fast Switching
• Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface mount
package. The D2PAK (TO-263) is suitable for high current
applications
because
of
its low
internal
connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 2.7 mH, Rg = 25 , IAS = - 19 A (see fig. 12).
c. ISD  - 19 A, dI/dt  200 A/μs, VDD  VDS, TJ  175 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material)
PRODUCT SUMMARY
VDS (V)
- 100
RDS(on) ()VGS = - 10 V
0.20
Qg (Max.) (nC)
61
Qgs (nC)
14
Qgd (nC)
29
Configuration
Single
S
G
D
P-Channel MOSFET
D2PAK (TO-263)
G D
S
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free
SiHF9540S-GE3
SiHF9540STRL-GE3a
Lead (Pb)-free
IRF9540SPbF
IRF9540STRLPbFa
SiHF9540S-E3
SiHF9540STL-E3a
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDS
- 100
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current
VGS at - 10 V
TC = 25 °C
ID
- 19
A
TC = 100 °C
- 13
Pulsed Drain Currenta
IDM
- 72
Linear Derating Factor
1.0
W/°C
Linear Derating Factor (PCB Mount)e
0.025
Single Pulse Avalanche Energyb
EAS
640
mJ
Repetitive Avalanche Currenta
IAR
- 19
A
Repetitive Avalanche Energya
EAR
15
mJ
Maximum Power Dissipation
TC = 25 °C
PD
150
W
Maximum Power Dissipation (PCB Mount)e
3.7
Peak Diode Recovery dV/dtc
dV/dt
- 5.5
V/ns
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to + 175
°C
Soldering Recommendations (Peak Temperature)
for 10 s
300d
2014-8-28
1
www.kersemi.com


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