SN54HC125

SN74HC125

SCLS104E – AUGUST 1984 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

±20

mA

±20

mA

Continuous output current

±35

mA

±70

mA

Junction temperature

–65

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

2000

Electrostatic

V

discharge

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See

MIN

NOM

MAX

UNIT

Supply voltage

2

5

6

V

1.5

High-level input voltage

3.15

V

4.2

0.5

Low-level input voltage

1.35

V

1.8

Input voltage

0

V

Output voltage

0

V

1000

∆t/∆v

Input transition rise and fall time

500

ns

400

SN54HC125

–55

125

Operating free-air temperature

°C

SN74HC125

–40

85

(1)

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74LVC1G06

PW

D (SOIC)

DB (SSOP)

N (PDIP)

NS (SOP)

UNIT

(TSSOP)

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

86

96

80

76

113

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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