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STPTIC-33G2 Scheda tecnica(PDF) 8 Page - STMicroelectronics |
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STPTIC-33G2 Scheda tecnica(HTML) 8 Page - STMicroelectronics |
8 / 11 page Reflow profile STPTIC-33G2 8/11 DocID028149 Rev 1 3 Reflow profile Figure 11. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. Table 8. Recommended values for soldering reflow Profile Value Typical Max. Temperature gradient in preheat (T = 70-180 °C) 0.9 °C/s 3 °C/s Temperature gradient (T = 200-225 °C) 2 °C/s 3 °C/s Peak temperature in reflow 240-245 °C 260 °C Time above 220 °C 60 s 90 s Temperature gradient in cooling -2 to -3 °C/s -6 °C/s Time from 50 to 220 °C 160 to 220 s |
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