CDCM6208V1F datasheet(8/87 Pages) TI1

Il numero della parte	CDCM6208V1F

Spiegazioni elettronici	2:8 Clock Generator, Jitter Cleaner with Fractional Dividers

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Produttore elettronici	TI1 [Texas Instruments]

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CDCM6208V1F

SCAS943 – MAY 2015

www.ti.com

8.5 Thermal Information, Airflow = 150 LFM

(1) (2) (3) (4)

CDCM6208

THERMAL METRIC(1)

RGZ

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

21.8

RθJC(top)

Junction-to-case (top) thermal resistance

RθJB

Junction-to-board thermal resistance

6.61

°C/W

ψJT

Junction-to-top characterization parameter

0.37

ψJB

Junction-to-board characterization parameter

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.06

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(3)

Connected to GND with 36 thermal vias (0.3 mm diameter).

(4)

θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.

8.6 Thermal Information, Airflow = 250 LFM

(1) (2) (3) (4)

CDCM6208

THERMAL METRIC(1)

RGZ

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

19.5

RθJC(top)

Junction-to-case (top) thermal resistance

RθJB

Junction-to-board thermal resistance

6.6

°C/W

ψJT

Junction-to-top characterization parameter

0.45

ψJB

Junction-to-board characterization parameter

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.06

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(3)

Connected to GND with 36 thermal vias (0.3 mm diameter).

(4)

θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.

8.7 Thermal Information, Airflow = 500 LFM

(1) (2) (3) (4)

CDCM6208

THERMAL METRIC(1)

RGZ

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

17.7

RθJC(top)

Junction-to-case (top) thermal resistance

RθJB

Junction-to-board thermal resistance

6.58

°C/W

ψJT

Junction-to-top characterization parameter

0.58

ψJB

Junction-to-board characterization parameter

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.05

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(3)

Connected to GND with 36 thermal vias (0.3 mm diameter).

(4)

θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.

8

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