LM2664

SNVS005E – NOVEMBER 1999 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (V+ to GND, or GND to OUT)

5.8

V

SD

(GND

− 0.3)

(V+ + 0.3)

V

V+ and OUT continuous output current

50

mA

1

sec.

(4)

600

mW

(4)

150

°C

Lead temp. (soldering, 10 seconds)

300

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be

avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.

(4)

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Electrostatic

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2000

V

discharge

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating junction temperature

–40

85

°C

6.4 Thermal Information

LM2664

DBV

UNIT

6 PINS

Junction-to-ambient thermal resistance

210

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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