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TC622EAT Scheda tecnica(PDF) 8 Page - Microchip Technology |
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TC622EAT Scheda tecnica(HTML) 8 Page - Microchip Technology |
8 / 14 page TC622/TC624 DS21440B-page 8 © 2002 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form 5.3 Package Dimensions Component Taping Orientation for 8-Pin SOIC (Narrow) Devices Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size Standard Reel Component Orientation for TR Suffix Device PIN 1 User Direction of Feed P W 3 ° MIN. PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .310 (7.87) .290 (7.37) .400 (10.16) .310 (7.87) 8-Pin Plastic DIP Dimensions: inches (mm) |
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