NXP Semiconductors

BTA204W-600B

3Q Hi-Com Triac

BTA204W-600B

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Product data sheet

15 August 2014

6 / 15

8. Thermal characteristics

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to solder

point

full cycle and half cycle; Fig. 6

-

-

15

K/W

printed circuit board mounted: minimum

pad area; Fig. 7

-

70

-

K/W

thermal resistance

from junction to

ambient

printed circuit board mounted: minimum

footprint; Fig. 8

-

156

-

K/W

003aac210

1

10

1

10

(K/W)

P

t

Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width