TC1071 datasheet(3/16 Pages) MICROCHIP

Il numero della parte	TC1071

Spiegazioni elettronici	50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown

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Produttore elettronici	MICROCHIP [Microchip Technology]

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DS21353B-page 3

TC1070/TC1071/TC1187

TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATION

S (CONTINUED)

Electrical Characteristics: VIN =VOUT +1V, IL =0.1mA,CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

SHDN Input

VIH

SHDN Input High Threshold

45

——

%VIN

VIN =2.5V to6.5V

VIL

SHDN Input Low Threshold

—

15

%VIN

VIN =2.5V to6.5V

ADJ Input

IADJ

Adjust Input Leakage Current

—

50

—

pA

Note

1:

2:

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

3:

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.

4:

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.

5:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.

6: The minimum VIN has to justify the conditions: VIN ≥ VR +VDROPOUT and VIN ≥ 2.7V for IL =0.1mA to IOUT

MAX.

TC VOUT =(VOUTMAX –VOUTMIN)x 10

6

VOUT x ∆T

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