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LM2936HVBMA-5.0 Scheda tecnica(PDF) 4 Page - Texas Instruments

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Il numero della parte LM2936HVBMA-5.0
Spiegazioni elettronici  Ultra-Low Quiescent Current LDO Voltage Regulator
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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LM2936HVBMA-5.0 Scheda tecnica(HTML) 4 Page - Texas Instruments

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LM2936
SNOSC48O – JUNE 2000 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
MIN
MAX
UNIT
Input voltage (survival)
−50
60
V
Power dissipation (3)
Internally limited
Junction temperature (TJMAX)
150
°C
Storage temperature, Tstg
−65
150
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating ratings.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA) / RθJA. If this dissipation is exceeded, the die temperature can rise above the TJ(MAX) of 150°C, and
the LM2936 may go into thermal shutdown.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
Temperature, TJ
−40
125
°C
Input voltage, VIN , LM2936
5.5
40
V
Input voltage, VIN , LM2936HV only
5.5
60
V
Shutdown pin voltage, VSD, LM2936BM only
0
40
V
6.4 Thermal Information
LM2936
SOIC (D)
TO-252
VSSOP
SOT-223
TO-92 (LP)
THERMAL METRIC(1)
UNIT
(NDP)
(DGK)
(DCY)
8 PINS
3 PINS
8 PINS
4 PINS
3 PINS
RθJA
Junction-to-ambient thermal resistance
111.4
50.5
173.4
62.8
156.8
RθJC(top)
Junction-to-case (top) thermal resistance
56.3
52.6
65.9
44.2
80.4
RθJB
Junction-to-board thermal resistance
51.9
29.7
94.9
11.7
n/a
°C/W
ψJT
Junction-to-top characterization parameter
10.9
4.8
9.6
3.6
24.5
ψJB
Junction-to-board characterization parameter
51.4
29.3
93.3
11.6
136.0
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
1.6
n/a
n/a
n/a
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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