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TS3DV642 Scheda tecnica(PDF) 5 Page - Texas Instruments

Il numero della parte TS3DV642
Spiegazioni elettronici  TS3DV642 12-Channel 1:2 MUX/DEMUX with 1.8 V Compatible Control and Power-Down Mode
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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TS3DV642 Scheda tecnica(HTML) 5 Page - Texas Instruments

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TS3DV642
www.ti.com
SCDS343C – MAY 2013 – REVISED NOVEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
5.5
V
VI/O
Analog voltage range(2)(3)(4)
All I/O
–0.5
5.5
V
VIN
Digital input voltage range(2)(3)
SEL1, SEL2, EN
–0.5
5.5
V
II/OK
Analog port diode current
VI/O < 0
–50
mA
IIK
Digital input clamp current
VIN < 0
–50
mA
II/O
On-state switch current(5)
–128
128
mA
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–2000
2000
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
–1000
1000
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
2.6
4.5
V
VI/O
Input/Output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
TS3DV642
THERMAL METRIC(1)
QFN
UNIT
42 PINS
RθJA
Junction-to-ambient thermal resistance
31.5
RθJC(top)
Junction-to-case (top) thermal resistance
16.2
RθJB
Junction-to-board thermal resistance
5.5
°C/W
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
5.4
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.0
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013–2014, Texas Instruments Incorporated
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