BAS16_SER

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© NXP Semiconductors N.V. 2014. All rights reserved.

Product data sheet

Rev. 6 — 24 September 2014

5 of 21

NXP Semiconductors

BAS16 series

High-speed switching diodes

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB with 60

m copper strip line.

[3]

[4]

Single diode loaded.

[5]

Soldering point of cathode tab.

[6]

Soldering points at pins 4, 5 and 6.

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

BAS16

[1] -

-

500

K/W

BAS16H

[2] -

-

330

K/W

[3] -

-

150

K/W

BAS16J

[3] -

-

230

K/W

BAS16L

[2] -

-

500

K/W

BAS16VV

[2][4] -

-

700

K/W

[3][4] -

-

410

K/W

BAS16W

[1] -

-

625

K/W

thermal resistance from

junction to solder point

BAS16

-

-

330

K/W

BAS16H

[5] --70

K/W

BAS16J

[5] --55

K/W

BAS16T

-

-

350

K/W

BAS16VY

[4][6] -

-

260

K/W

BAS16W

-

-

300

K/W

BAS316

[5] -

-

150

K/W

BAS516

[5] -

-

120

K/W